Lantronix G520 Series 4G LTE Cat 4 and 5G Cellular Gateways are designed to meet the challenges of Industry 4.0, Security and Transportation markets with three/four separate gateways, all based on no-name ARM926EJ processor -S running at 600 MHz, which is very likely. Microchip SAM9X60 processor introduced in 2020.
All gateways come from the same base with variations for specific markets:
- G526 industrial gateway with LTE Cat 4 Ethernet, serial, I/O, fieldbus conversion and other industrial protocols
- G527/G528 Security Gateway with Cat 13 or 5G LTE, Embedded Cryptographic Security Element and PSE-PoE
- G528 transport gateway (coming soon) with LTE Cat 4, GNSS, accelerometer, CAN bus reading and other tracking functions
- SoC – ARM926EJ-S based processor running at 600 MHz with 32 KB instruction cache and 32 KB data cache
- System Memory – 256MB DDR2 SDRAM
- Storage – 8MB SPI flash for operating system, 256MB parallel NAND flash, MicroSD slot or USB drive for user data storage
- Cellular options
- LTE Cat. 4 with 3G and, depending on the regional variant, 2G fallback modes on industrial packaging
- LTE Cat 13 (uplink) / 7 (downlink) with 3G fallback mode enabled security package
- 5G, Sub-6GHz with LTE Cat. 13 (uplink) / Cat. 20 (downlink) and 3G fallback modes
- Dual SIM / Single standby via two mechanically secured mini-SIM carriers WHERE MFF2 SIM(s) combination of (i) ‘MFF2 + mini’; or (ii) ‘mini+MFF2’; or (iii) “MFF2 + MFF2” SIM cards, replacing the two standard mini-SIM trays.
- Wi-Fi and Bluetooth
- 2T2R Wi-Fi 5 via RP-SMA antenna connector
- Bluetooth 5.1 via Wi-Fi’s rightmost RP-SMA antenna connector
- 2T2R Wi-Fi6/6E optional
- Dual 10/100M Ethernet with 1x RJ45 LAN port and 1x RJ45 WAN port user reconfigurable as second LAN port
- Qualcomm IZat Location Services, Gen. 8c/9c or u-blox M8 (transport package)
- Simultaneous GPS and GLONASS (5G model security gateway)
- Cellular options
- USB – 1x USB Type-A host port
- Full RS-232 via DB9 connector
- RS-485 via 5-pin COMBICON connector
- 2x I/O with common ground via 3-pin COMBICON header and tool-free socket configurable as analog input or digital output
- Input: 0V ~ 2.5V DC (zero); 3V to 50V DC (Un)
- Output: open collector; 200mA max. ; 50 V DC max.
- Sensor – 3-Axis Accelerometer (STMicroelectronics LIS331DLH)
- HW Security – Microchip ATECC608 Secure Element on security variant
- 9x LEDs for power, connectivity, some user programmable
- RTC with 100-day data retention period, lithium-manganese battery of approximately 15 mWh (not functional below -20°C)
- Power source
- Input voltage – 10.8 to 60 V DC via 3-pin Nano-Fit connector
- PSE-PoE+ for Security package only (30 W per LAN port)
- “Last Gasp” with approximately 100 seconds of autonomy via 2 Li-ion batteries of 96 mWh (not functional below -10°C)
- Digital input (ignition) on the third pin of the 3-pin header
- Dimensions – 131.5 x 81.27 x 25 mm without connectors (brushed aluminum alloy housing)
- Weight – Approximately 300 grams
- Temperature and humidity
- Operation: -30°C to +70°C; up to 95% RH
- Storage: -40°C to +85°C; up to 95% relative humidity
Each gateway is pre-configured with Lantronix’s ConsoleFlow cloud-based device management and comes with a web-based user interface to configure networking (WiFi, Ethernet, Cellular, VPN, routing…), security (firewall, VLAN, SIM pin, etc.), and industrial communication protocols which include EtherCAT, DLMS Client, DNP3 Outstation, Modbus Master, IEC104 Slave and IEC 101 Master.
Although not specified in the description, the Lantronix G520 series Cellular IoT Gateways clearly run OpenWrt as the company offers a G520 SDK for building custom packages and creating custom firmware images, and the documentation assumes that “you have a computer running a supported Linux distribution (or VM) and are familiar with the OpenWrt build system and Lantronix Web Admin to configure G520 series devices.
The G520 Industrial (G526) and G520 Security (4G LTE: G527, 5G: G528) gateways are available now, while G520 Transport (G529_) will arrive later this year. Pricing has not been publicly disclosed, and more details can be found in the Press release and on the product sheet.
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